| Product | Standard Flex Circuits | High Density Interconnect（HDI）Flex | Flat Flexible Circuits | Rigid Flex Circuits | Membrane Switches |
| Standard Panel Size | 250mm*400mm | 100mm*100mm | Roll format | 250mm*400mm | 250mm*400mm |
| Line Width and Spacing | 0.003″(0.0076mm) | 0.00075″(19um) | 0.01″(0.254mm) | 0.003″(0.076mm) | 0.01″(0.254mm) |
| copper thickness | 1/2 oz.And higher | 1/4 to 1/2 oz | 0.028mm-0.01mm | 1/2 oz.And Higher | 0.0005″-0.0010″ |
| Layer Count | 10(To Date) | 2 typical Max of 4 | Single;both sides | 18（To Date） | Up to 4 |
| Via/Drill/Size | |||||
| Minimum Drill（Mechanical）Hole Diameter | 0.008″(0.2mm) | 0.006″(0.15mm) | N/A | 0.008″(0.2mm) | 10 mil(0.25mm) |
| Minimum Via（Laser）Size | 5 mil(0.13mm) | 1 mil(0.025mm) | N/A | 6 mil(0.15mm) | N/A |
| Minimum Micro Via（Laser）Size | 3 mil(0.076mm) | 1 mil(0.025mm) | N/A | 3 mil(0.076mm) | N/A |
| Stiffener Material | Polyimide/FR4/Metal | PET | FR-4/Polyimide | PET/Metal/FR-4 | |
| Shielding Material | Copper/Silver Ink/Tatsuta/Carbon | Silver Foil/Tatsuta | Copper/Silver Ink/Tatsuta/Carbon | Silver Foil | |
| Tooling Tolerance | 2 mil(0.051mm) | 2 mil(0.051mm) | 10 mil(0.25mm) | 2 mil(0.051mm) | 5 mil(0.13mm) |
| Zif Tolerance | 2 mil(0.051mm) | 1 mil(0.025mm) | 10 mil(0.25mm) | 2 mil(0.051mm) | 5 mil(0.13mm) |
| SOLDER MASK | |||||
| Solder Mask Bridge Between Dam | 5 mil(0.13mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 10 mil(0.25mm) |
| Solder Mask Registration Tolerance | 4 mil(0.10mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
| COVERLAY | |||||
| Coverlay Registration | 8 mil | 5 mil | 10 mil | 8 mil | 10 mil |
| PIC Registration | 7 mil | 4 mil | N/A | 7 mil | N/A |
| Solder Mask Registration | 5 mil | 4 mil | N/A | 5 mil | 5 mil |
| STIFFENER | |||||
| PI Stiffener | |||||
| Stiffener Registration | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) |
| Thickness Tolerance | 10% | 10% | 10% | 10% | 10% |
| FR4 Stiffener | |||||
| Stiffener Registration | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) |
| Thickness Tolerance | 10% | 10% | 10% | 5 mil | 10% |
| Legend | |||||
| Minimum Height | 35 mil | 25 mil | 35 mil | 35 mil | Graphic Overlay |
| Minimum Width | 8 mil | 6 mil | 8 mil | 8 mil | |
| Minimum Space | 8 mil | 6 mil | 8 mil | 8 mil | |
| Registration | ±5 mil | ±5 mil | ±5 mil | ±5 mil | |
| Impedance | ±10% | ±10% | ±20% | ±10% | N/A |
| SRD（Steel Rule Die） | |||||
| Outline Tolerance | 5 mil(0.13mm) | 2 mil(0.051mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
| Minimum radius | 5 mil(0.13mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
| Inside Radius | 20 mil(0.51mm) | 10 mil(0.25mm) | N/A | 31 mil | 20 mil(0.51mm) |
| Punch Minimum Hole Size | 40 mil(1.02mm) | 31.5 mil(0.8mm) | N/A | N/A | 40 mil(1.02mm) |
| Tolerance of Punch Hole Size | ±2 mil(0.051mm) | ±1 mil | N/A | N/A | ±2 mil(0.051mm) |
| Slot Width | 20 mil(0.51mm) | 15 mil(0.38mm) | N/A | 31 mil | 20 mil(0.51mm) |
| Tolerance of hole to outline | ±3 mil | ±2 mil | N/A | ±4 mil | 10 Mil |
| Tolerance of hole edge to outline | ±4 mil | ±3 mil | N/A | ±5 mil | 10 Mil |
| Minimum of Trance to outline | 8 mil | 5 mil | N/A | 10 mil | 10 Mil |
| Model Number | YBD02C00049A |
|---|---|
| Size | 80*57.69mm |
| Layer | 2 |
| Base Material | PI |
| Board Thickness | 0.12mm |
| Copper Thickness | 20um |
| Min. Hole Size | 0.2mm |
| Min. Line Width | 0.075mm |
| Min. Line Spacing | 0.075mm |
| Surface Finishing | ENIG (gold) 1 to 2 micro inches |
| Application | Phone |
| MOQ | 1PCS |
| Certificate | ISO14001/IATF16949/PCB UL E507388/FPC UL E506860/ROHS/ISO9001 |
| Place of Origin | China |
| Supply Ability | 30000 Set/Sets per Month |
| Lead Time | 2 days |
