Product | Standard Flex Circuits | High Density Interconnect(HDI)Flex | Flat Flexible Circuits | Rigid Flex Circuits | Membrane Switches |
Standard Panel Size | 250mm*400mm | 100mm*100mm | Roll format | 250mm*400mm | 250mm*400mm |
Line Width and Spacing | 0.003″(0.0076mm) | 0.00075″(19um) | 0.01″(0.254mm) | 0.003″(0.076mm) | 0.01″(0.254mm) |
copper thickness | 1/2 oz.And higher | 1/4 to 1/2 oz | 0.028mm-0.01mm | 1/2 oz.And Higher | 0.0005″-0.0010″ |
Layer Count | 10(To Date) | 2 typical Max of 4 | Single;both sides | 18(To Date) | Up to 4 |
Via/Drill/Size | |||||
Minimum Drill(Mechanical)Hole Diameter | 0.008″(0.2mm) | 0.006″(0.15mm) | N/A | 0.008″(0.2mm) | 10 mil(0.25mm) |
Minimum Via(Laser)Size | 5 mil(0.13mm) | 1 mil(0.025mm) | N/A | 6 mil(0.15mm) | N/A |
Minimum Micro Via(Laser)Size | 3 mil(0.076mm) | 1 mil(0.025mm) | N/A | 3 mil(0.076mm) | N/A |
Stiffener Material | Polyimide/FR4/Metal | PET | FR-4/Polyimide | PET/Metal/FR-4 | |
Shielding Material | Copper/Silver Ink/Tatsuta/Carbon | Silver Foil/Tatsuta | Copper/Silver Ink/Tatsuta/Carbon | Silver Foil | |
Tooling Tolerance | 2 mil(0.051mm) | 2 mil(0.051mm) | 10 mil(0.25mm) | 2 mil(0.051mm) | 5 mil(0.13mm) |
Zif Tolerance | 2 mil(0.051mm) | 1 mil(0.025mm) | 10 mil(0.25mm) | 2 mil(0.051mm) | 5 mil(0.13mm) |
SOLDER MASK | |||||
Solder Mask Bridge Between Dam | 5 mil(0.13mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 10 mil(0.25mm) |
Solder Mask Registration Tolerance | 4 mil(0.10mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
COVERLAY | |||||
Coverlay Registration | 8 mil | 5 mil | 10 mil | 8 mil | 10 mil |
PIC Registration | 7 mil | 4 mil | N/A | 7 mil | N/A |
Solder Mask Registration | 5 mil | 4 mil | N/A | 5 mil | 5 mil |
STIFFENER | |||||
PI Stiffener | |||||
Stiffener Registration | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) |
Thickness Tolerance | 10% | 10% | 10% | 10% | 10% |
FR4 Stiffener | |||||
Stiffener Registration | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) | 10 mil(0.25mm) |
Thickness Tolerance | 10% | 10% | 10% | 5 mil | 10% |
Legend | |||||
Minimum Height | 35 mil | 25 mil | 35 mil | 35 mil | Graphic Overlay |
Minimum Width | 8 mil | 6 mil | 8 mil | 8 mil | |
Minimum Space | 8 mil | 6 mil | 8 mil | 8 mil | |
Registration | ±5 mil | ±5 mil | ±5 mil | ±5 mil | |
Impedance | ±10% | ±10% | ±20% | ±10% | N/A |
SRD(Steel Rule Die) | |||||
Outline Tolerance | 5 mil(0.13mm) | 2 mil(0.051mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
Minimum radius | 5 mil(0.13mm) | 4 mil(0.10mm) | N/A | 5 mil(0.13mm) | 5 mil(0.13mm) |
Inside Radius | 20 mil(0.51mm) | 10 mil(0.25mm) | N/A | 31 mil | 20 mil(0.51mm) |
Punch Minimum Hole Size | 40 mil(1.02mm) | 31.5 mil(0.8mm) | N/A | N/A | 40 mil(1.02mm) |
Tolerance of Punch Hole Size | ±2 mil(0.051mm) | ±1 mil | N/A | N/A | ±2 mil(0.051mm) |
Slot Width | 20 mil(0.51mm) | 15 mil(0.38mm) | N/A | 31 mil | 20 mil(0.51mm) |
Tolerance of hole to outline | ±3 mil | ±2 mil | N/A | ±4 mil | 10 Mil |
Tolerance of hole edge to outline | ±4 mil | ±3 mil | N/A | ±5 mil | 10 Mil |
Minimum of Trance to outline | 8 mil | 5 mil | N/A | 10 mil | 10 Mil |
Model Number | YBD02C00270A |
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Size | 78*59.64mm |
Layer | 2 |
Base Material | PI |
Board Thickness | 0.12mm |
Copper Thickness | 20um |
Min. Hole Size | 0.2mm |
Min. Line Width | 0.075mm |
Min. Line Spacing | 0.075mm |
Surface Finishing | ENIG (gold) 1 to 2 micro inches |
Application | Phone |
MOQ | 1PCS |
Certificate | ISO14001/IATF16949/PCB UL E507388/FPC UL E506860/ROHS/ISO9001 |
Place of Origin | China |
Supply Ability | 30000 Set/Sets per Month |
Lead Time | 2 days |