DVD FPCB

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Product Standard Flex Circuits High Density Interconnect(HDI)Flex Flat Flexible Circuits Rigid Flex Circuits Membrane Switches
Standard Panel Size 250mm*400mm 100mm*100mm Roll format 250mm*400mm 250mm*400mm
Line Width and Spacing 0.003″(0.0076mm) 0.00075″(19um) 0.01″(0.254mm) 0.003″(0.076mm) 0.01″(0.254mm)
copper thickness 1/2 oz.And higher 1/4 to 1/2 oz 0.028mm-0.01mm 1/2 oz.And Higher 0.0005″-0.0010″
Layer Count 10(To Date) 2 typical Max of 4 Single;both sides 18(To Date) Up to 4
Via/Drill/Size
Minimum Drill(Mechanical)Hole Diameter 0.008″(0.2mm) 0.006″(0.15mm) N/A 0.008″(0.2mm) 10 mil(0.25mm)
Minimum Via(Laser)Size 5 mil(0.13mm) 1 mil(0.025mm) N/A 6 mil(0.15mm) N/A
Minimum Micro Via(Laser)Size 3 mil(0.076mm) 1 mil(0.025mm) N/A 3 mil(0.076mm) N/A
Stiffener Material Polyimide/FR4/Metal PET FR-4/Polyimide PET/Metal/FR-4
Shielding Material Copper/Silver Ink/Tatsuta/Carbon Silver Foil/Tatsuta Copper/Silver Ink/Tatsuta/Carbon Silver Foil
Tooling Tolerance 2 mil(0.051mm) 2 mil(0.051mm) 10 mil(0.25mm) 2 mil(0.051mm) 5 mil(0.13mm)
Zif Tolerance 2 mil(0.051mm) 1 mil(0.025mm) 10 mil(0.25mm) 2 mil(0.051mm) 5 mil(0.13mm)
SOLDER MASK
Solder Mask Bridge Between Dam 5 mil(0.13mm) 4 mil(0.10mm) N/A 5 mil(0.13mm) 10 mil(0.25mm)
Solder Mask Registration Tolerance 4 mil(0.10mm) 4 mil(0.10mm) N/A 5 mil(0.13mm) 5 mil(0.13mm)
COVERLAY
Coverlay Registration 8 mil 5 mil 10 mil 8 mil 10 mil
PIC Registration 7 mil 4 mil N/A 7 mil N/A
Solder Mask Registration 5 mil 4 mil N/A 5 mil 5 mil
STIFFENER
PI Stiffener
Stiffener Registration 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm)
Thickness Tolerance 10% 10% 10% 10% 10%
FR4 Stiffener
Stiffener Registration 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm) 10 mil(0.25mm)
Thickness Tolerance 10% 10% 10% 5 mil 10%
Legend
Minimum Height 35 mil 25 mil 35 mil 35 mil Graphic Overlay
Minimum Width 8 mil 6 mil 8 mil 8 mil
Minimum Space 8 mil 6 mil 8 mil 8 mil
Registration ±5 mil ±5 mil ±5 mil ±5 mil
Impedance ±10% ±10% ±20% ±10% N/A
SRD(Steel Rule Die)
Outline Tolerance 5 mil(0.13mm) 2 mil(0.051mm) N/A 5 mil(0.13mm) 5 mil(0.13mm)
Minimum radius 5 mil(0.13mm) 4 mil(0.10mm) N/A 5 mil(0.13mm) 5 mil(0.13mm)
Inside Radius 20 mil(0.51mm) 10 mil(0.25mm) N/A 31 mil 20 mil(0.51mm)
Punch Minimum Hole Size 40 mil(1.02mm) 31.5 mil(0.8mm) N/A N/A 40 mil(1.02mm)
Tolerance of Punch Hole Size ±2 mil(0.051mm) ±1 mil N/A N/A ±2 mil(0.051mm)
Slot Width 20 mil(0.51mm) 15 mil(0.38mm) N/A 31 mil 20 mil(0.51mm)
Tolerance of hole to outline ±3 mil ±2 mil N/A ±4 mil 10 Mil
Tolerance of hole edge to outline ±4 mil ±3 mil N/A ±5 mil 10 Mil
Minimum of Trance to outline 8 mil 5 mil N/A 10 mil 10 Mil
Model Number

YBD02C00049A

Size

80*57.69mm

Layer

2

Base Material

PI

Board Thickness

0.12mm

Min. Hole Size

0.2mm

Min. Line Width

0.075mm

Min. Line Spacing

0.075mm

Surface Finishing

ENIG (gold) 1 to 2 micro inches

Application

Phone

MOQ

1PCS

Certificate

ISO14001/IATF16949/PCB UL E507388/FPC UL E506860/ROHS/ISO9001

Place of Origin

China

Supply Ability

30000 Set/Sets per Month

Lead Time

2 days

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